As technology advances and electronic devices become smaller and more powerful, the need for effective protection against mechanical stress and thermal cycling becomes increasingly critical. This is where underfill and edgebond techniques come into play.

Underfill refers to a process where a specialized adhesive material is applied to fill the gap between a microchip or electronic component and its substrate. This helps distribute stress and enhance the mechanical reliability of the assembly. Underfill materials also need to consider factors such as gap filling, matching the coefficient of thermal expansion (CTE) of the components and the substrate, and flowability to ensure optimal performance. 

Edgebond, on the other hand, is a technique used to secure and protect the edges of electronic assemblies. It provides a clean and uniform appearance along the edges while also protecting against mechanical stress, such as bending or impact. Edgebond materials need to exhibit strong adhesion to the substrate and components, as well as resistance to environmental factors, to ensure long-term reliability.

Both edgebond and underfill techniques share some similar technical requirements, such as strong adhesion, mechanical strength, and resistance to environmental factors. However, they also have distinct requirements specific to each process. Underfill materials need to focus on gap filling, CTE matching, and flowability, while edgebond materials need to consider aesthetics and edge protection.

In terms of application, underfill materials are more commonly used in applications with smaller chips, where they offer superior chip protection. Edgebond, on the other hand, has significant advantages in terms of process performance and cost for slightly larger chips.

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Typical Products:

1.Underfill: EW 6710 EW 6078

    •Excellent resistance to mechanical shock or vibration. 

    •Low viscosity and good flowability

    •Reworkable 

2.Edgebond: EW 6330

    •Excellent adhesion to a variety of substrates, such as: FPC, PCB, etc. 

    •Excellent resistance to mechanical shock or vibration 

    •Thixotropic with good controlled flowability

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