Thermal Interface Materials (TIM), a critical component for enhancing heat conduction efficiency, play a pivotal role in bridging microgaps and surface irregularities when two materials are joined. Widely utilized across various sectors such as consumer electronics, new energy vehicles, energy storage, communication stations, data centers, and aerospace, TIMs aid in efficient heat dissipation, maintaining equipment stability and reliability.

Key Parameters with Corresponding Testing Methods for TIMs：

1. Thermal Conductivity (TC):

• Represents the material's ability to conduct heat, calculated as the rate of heat flow through unit thickness and unit area.

• Example Test Standards: ASTM E1530, ISO 22007-2, IEC 62830-2

2. Interface Contact Resistance (ICR):

• Reflects the thermal resistance between the TIM and the contacting surface.

• Example Test Standards: ASTM D5470, ASTM D5930, ISO 22007-3

3. Compressibility:

• Assesses material deformation and recovery under pressure, determining contact performance and thermal conductivity.

• Example Test Standards: ASTM F36, ISO 3386-1

4. Thermal Stability:

• Evaluates material performance changes and degradation under high-temperature conditions.

• Example Test Standards: ASTM D5483, ISO 10563

Future trends in TIM development include:

• Achieving higher thermal conductivity

• Adapting to thinner and more compact designs

• Addressing high-temperature applications

• Ensuring reusability

• Prioritizing environmental friendliness and sustainability

Typical Products:

1. N-Sil 8630:

• High thermal conductivity

• Excellent aging resistance

• suitable for steel mesh printing

2. N-Sil 8745:

• Single-component

• easy operation

• outstanding aging performance

• high thermal conductivity of 4.6W/(m·K)

3. N-Sil 8742M:

• Excellent mechanical impact and vibration resistance

• Exceptional flexibility

• Flame-retardant UL94-V0

4. N-Sil 8516W:

• Excellent adhesion to various substrates

• High thermal conductivity of 1.6W/(m·K)

• Good flexibility

5. N-Sil 8275:

• Outstanding bonding strength on various substrates

• High-temperature resistance

• Low shrinkage

• Mechanical stress

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