Two-component polyurethane structural adhesive: excellent adhesion to a variety of substrates, halogen-free, excellent high temperature and humidity reliability, easy to apply in a variety of ways

Two-component epoxy for bonding or reinforcing electronic components, excellent adhesion to a variety of substrates, high thixotropy, long operating time, easy to apply in a variety of ways

UV moisture curing polyurethane coating, for coating, fast UV radiation curing, followed by moisture curing, low odor, excellent adhesion properties for FPC and PCB, excellent electrical properties,

High thermal conductivity, low thermal resistance, excellent high temperature aging resistance, good stencil printability, very low thermal weight loss, easy to repair

Excellent mechanical shock and vibration resistance, excellent ductility, excellent interfacial wetting performance, high thermal conductivity >2.0W/(m·K), in line with UL94-V0 flame retardant rating

It has excellent adhesion performance, excellent vibration and impact resistance, supports dual curing methods at room temperature and heating, and has a thermal conductivity of 1.2W/(m·K), which meets the UL94-V0 flame retardant rating

N-SIL 8210 is a two-component silicone-based thermally conductive material. It can be cured at room temperature or heat for maximum adhesion. The product is suitable for potting power adapters or connectors with heat dissipation requirements, suitable thermal conductivity, high reliability and excellent impact resistance, low shrinkage and mechanical stress

N-Sil 8772 is a two-part, solvent free, thermally conductive gap filler that is based on silicone system.It is ideal for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing

N-SIL 8206 is a two-component thermally conductive material based on silicone systems. It can cure at room temperature or heat for maximum adhesion and is suitable for potting and sealing where high heat dissipation is required. Typical applications are the packaging of LED lighting power supplies and the thermal conductivity packaging of power conversion devices, with high reliability and excellent impact resistance, low shrinkage and mechanical stress, and UL94_V0

EW 6303 is a one-component, solvent-free, heat-curing epoxy adhesive with excellent adhesion to a wide range of substrates, excellent resistance to mechanical shock or vibration, excellent insulation properties, and excellent resistance to environmental aging

N-SIL 8180 is a one-component, solvent-free, heat-curing, silicone-based CIPG suitable for sealing and bonding of metal and surface-treated substrates with high temperature resistance; Thermally stable and can be stored at room temperature

CollTech Flyer_Energy storage_General_EN_20240318