One-component heat-curing epoxy underfill: excellent resistance to mechanical shock or vibration, easy to apply in multiple ways, low viscosity and good flowability, can be repaired

Two-component heat-curing epoxy structural adhesive: excellent adhesion to a variety of substrates, halogen-free, excellent high temperature and humidity reliability, easy to apply in a variety of ways

One-component heat-curing epoxy structural adhesive for chip corner binding: high reliability

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, easy to apply in a variety of ways, fire resistance

Heat-curing epoxy for bonding or potting of electronic components, fast curing, excellent resistance to mechanical shock or vibration, good bending resistance, good flexibility

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing low fill, used for CSP or BGA solder joint protection underfill, can be reworked, good compatibility with flux, good flow and fast curing, excellent resistance to mechanical stress and warm stamping

Two-component epoxy for bonding or reinforcing electronic components, excellent adhesion to a variety of substrates, high thixotropy, long operating time, easy to apply in a variety of ways

Two-component epoxy, used for bonding or reinforcing electronic components, has excellent adhesion to a variety of substrates, optical transparency, low viscosity, good flowability, good waterproofing and aging resistance

Two-component epoxy for bonding or reinforcing electronic components, excellent adhesion to a variety of substrates, high thixotropy, long operating time, easy to apply in a variety of ways

EW 6513-1 is a one-part, non-conductive, thermal curing adhensive based on epoxy system . It is ideal for die attach bonding where non-conductivity is required, It could be widely used in the semiconductor industry, Good adhesion on a variety of substrates, such as: Cu, PPF and Ag surface,Excellent dispensability with minimal trailing and stringing,No die tilt issue,Excellent performance with dipping or dispensing process