Two-component polyurethane structural adhesive: excellent adhesion to a variety of substrates, halogen-free, excellent high temperature and humidity reliability, easy to apply in a variety of ways

HM PUR, Used for bonding and sealing a variety of substrates, it has excellent bonding strength on a variety of substrates, good chemical and environmental aging resistance, initial cooling and curing, and then curing by moisture

HM PUR, Used for bonding and sealing a variety of substrates, good chemical and environmental aging resistance, good chemical and environmental aging resistance, initial cooling and curing, followed by moisture curing

UV moisture curing polyurethane coating, for coating, fast UV radiation curing, followed by moisture curing, low odor, excellent adhesion properties for FPC and PCB, excellent electrical properties,

It has excellent adhesion performance, excellent vibration and impact resistance, supports dual curing methods at room temperature and heating, and has a thermal conductivity of 1.2W/(m·K), which meets the UL94-V0 flame retardant rating

N-PU 5663ST is a one-component, solvent-free, reactive hot melt polyurethane adhesive suitable for bonding and sealing a wide range of materials, pressure-sensitive, providing good initial strength, initial cooling and subsequent moisture curing, good chemical and environmental aging resistance, low viscosity and long open time.

N-PU 5663 is a one-component, reactive hot melt polyurethane adhesive suitable for bonding and sealing a variety of materials, pressure-sensitive, providing good initial strength immediately after bonding, excellent bonding strength on a variety of substrates, good chemical and environmental aging resistance, low viscosity and fast curing

N-PU 5667F(W) is a one-part, solvent free, reactive hotmelt adhesive based on PU system.structural bonding of mobile electronic devices such as smartphones, tablets and laptops. The adhesive is pressure sensitive and gives good initial strength after bonding.

N-PU 5612TC is a one-part, solvent free, reactive hotmelt adhesive based on PU system.structural bonding of mobile electronic devices such as smartphones, tablets and laptops. The adhesive is pressure sensitive and gives good initial strength after bonding.