Thermally conductive modified silanes for thermally conductive bonding of electronic components: no organotin, excellent impact or vibration resistance, low contact thermal resistance, can be repaired

UV moisture-cured acrylic is used for sealing, potting and bonding on a variety of materials, rapid UV radiation curing, and then moisture curing to cover the shadow area, suitable flexibility and softness

UV moisture curing acrylic for sealing, potting and bonding of plastics, glass, metal and FR4, as well as protecting sensitive components on PCBs/FPCBs, rapid UV curing followed by moisture curing to cover shadow parts, IBOA free

UV moisture curing acrylic for PC sealing and bonding on a variety of materials such as PMMA, glass, aluminum and stainless steel, rapid UV curing, followed by moisture curing to cover shadow parts, good flexibility and softness, IBOA free

UV moisture-cured acrylic for bonding on a wide range of materials. Typical applications are camera modules, lens and IR filter bonding, rapid UV curing, followed by moisture curing to cover shadows, good flexibility and softness, IBOA-free

UV moisture-cured acrylic for bonding on a wide range of materials. Typical applications are camera modules, lens and IR filter bonding, rapid UV curing, followed by moisture curing to cover shadows, good flexibility and softness, IBOA-free

UV moisture-cured acrylic for bonding on a wide range of materials. Typical applications are camera modules, lens and IR filter bonding, rapid UV curing, followed by moisture curing to cover the shadows, suitable flexibility and softness, IBOA-free

UV moisture-cured acrylic for sealing and bonding on a variety of materials such as plastics to meet the needs of high humidity environments, rapid UV radiation curing, followed by moisture curing to cover shadow areas, IBOA-free

UV moisture curing acrylic for sealing, potting and bonding of plastics, glass, metal and FR4, as well as to protect sensitive components on PCBs/FPCBs, rapid UV curing, followed by moisture curing to cover shadow parts, good flexibility and softness, IBOA free

UV moisture curing polyurethane coating, for coating, fast UV radiation curing, followed by moisture curing, low odor, excellent adhesion properties for FPC and PCB, excellent electrical properties,

PW 1465 is a one-part, UV and moisture dua curing adhesive based on acrylate hybrid system. It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

PW 2440MR is a one-component, solvent-free, UV-moisture dual-cure adhesive based on an acrylate hybrid system. It is suitable for sealing, potting and bonding plastics, glass, metal and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

EW 6329 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for bonding or sealing of electronic components

N-PU 5663 is a one-component, reactive hot melt polyurethane adhesive suitable for bonding and sealing a variety of materials, pressure-sensitive, providing good initial strength immediately after bonding, excellent bonding strength on a variety of substrates, good chemical and environmental aging resistance, low viscosity and fast curing

PW 2460N-1L is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.