Thermally conductive modified silanes for thermally conductive bonding of electronic components: no organotin, excellent impact or vibration resistance, low contact thermal resistance, can be repaired

One-component thermal grease: high thermal conductivity, low modulus and mechanical stress, easy to apply and remove with alcohol or acetone, high temperature resistance

Thermal grease for thermal management of heat sinks, memory and chipsets, power transistor CPUs, etc., suitable thermal conductivity, easy to apply and remove with alcohol or acetone, high temperature resistance, no drying problems, low viscosity

Thermal grease for thermal management of heat sinks, memory and chipsets, power transistor CPUs, etc., suitable thermal conductivity, easy to apply and remove with alcohol or acetone, high temperature resistance, no drying problems, low viscosity

N-Sil 8630M is a one-component thermal grease. It is a highly filled compound that is not flowing, has high thermal conductivity, low modulus and mechanical stress, is easy to coat and remove with alcohol or acetone, is resistant to high temperatures, has good high temperature cycle reliability, and has low oil permeability

Thermally conductively modified silanes for thermally conductive bonding of electronic components, organotin free, excellent impact or vibration resistance, low contact thermal resistance, reworkable

Two-part, solvent free, thermally conductive gap filler, easily repairable and removable, low density, lightweight, low viscosity for easy dispensing, and it is suitable for non-wearing point dispensing systems, high thermal conductivity, >2.0W/(m·K).

CollTech's high-performance Thermal Interface Materials (TIM) excel under demanding conditions, effectively dissipating heat and ensuring long-term reliability for devices operating in challenging environments.

High thermal conductivity, low thermal resistance, excellent high temperature aging resistance, good stencil printability, very low thermal weight loss, easy to repair

It has excellent adhesion performance, excellent vibration and impact resistance, supports dual curing methods at room temperature and heating, and has a thermal conductivity of 1.2W/(m·K), which meets the UL94-V0 flame retardant rating

N-SiL 8628LS is a one-component thermal grease, which is a non-flowing, highly filled compound, typical applications include thermal management of heat sinks, memory and chips, power transistors and CPUs, high thermal conductivity, low modulus and mechanical stress, easy coating and removal with alcohol or acetone, high temperature resistance, good high temperature cycle reliability, low oil permeability

N-SIL 8762 is a one-component thermally conductive gel, which is a highly filled, non-silicone compound, this product is suitable for applications that require high thermal conductivity, the material is easy to remove from the substrate, high thermal conductivity, easy to apply and remove with alcohol or isopropyl alcohol, high temperature resistance, good high temperature cycling reliability, low compressive force

N-SIL 8745 is a one-component thermally conductive gel that is a highly filled, non-silicone compound. The product is suitable for applications that require moderate thermal conductivity, the material is easy to remove from the substrate, high thermal conductivity, easy to apply and remove with alcohol or isopropyl alcohol, high temperature resistance, good high temperature cycling reliability, low compressive force

N-SIL 8220L1 is a two-component silicone-based thermally conductive material. It can be cured at room temperature or heat for maximum adhesion. The product is suitable for applications with high heat dissipation requirements, typical applications are potting protection of photovoltaic, wind power, energy storage systems and on-board charger inverters [OBC], high thermal conductivity, low shrinkage and mechanical stress, high reliability and excellent impact resistance

N-SIL 8275 is a two-component, solvent-free, room-temperature curing, silicone-based sealant for PTC heater encapsulation, high temperature resistance, excellent bond strength on a wide range of substrates, low shrinkage and mechanical stress, high reliability and excellent impact resistance