One-component thermosetting conductive silicone CIPG, mainly used for electromagnetic shielding and sealing: suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Conductive silica gel, used for electromagnetic shielding CIPG, curable at room temperature, excellent electromagnetic shielding performance, excellent sealing

Conductive silica gel, used for conductive bonding, easy to apply glue in a variety of ways, high bonding strength, good reflux resistance, low volume resistivity

N-SIL 8381 is a two-component, heat-curing, copper-conductive microparticle and silicone based CIPG. This product is suitable for applications that require good electrical conductivity and sealing properties. Typical applications include electromagnetic shielding of electronic device enclosures.

EW 6356-8,one-part, solvent free, thermal curing adhesive,epoxy system,It is designed for grounding where conductivity is required. Typical applications include CCM/semiconductor