One-component heat-curing epoxy underfill: excellent resistance to mechanical shock or vibration, easy to apply in multiple ways, low viscosity and good flowability, can be repaired

Room temperature vulcanized silicone sealant for waterproofing, good flexibility and softness, low viscosity and good fluidity, excellent electrical properties, good sealing and reflux resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, easy to apply in a variety of ways, fire resistance

Heat-curing low fill, used for CSP or BGA solder joint protection underfill, can be reworked, good compatibility with flux, good flow and fast curing, excellent resistance to mechanical stress and warm stamping

UV moisture curing polyurethane coating, for coating, fast UV radiation curing, followed by moisture curing, low odor, excellent adhesion properties for FPC and PCB, excellent electrical properties,

EW 6513-1 is a one-part, non-conductive, thermal curing adhensive based on epoxy system . It is ideal for die attach bonding where non-conductivity is required, It could be widely used in the semiconductor industry, Good adhesion on a variety of substrates, such as: Cu, PPF and Ag surface,Excellent dispensability with minimal trailing and stringing,No die tilt issue,Excellent performance with dipping or dispensing process

N-Sil 8118R is a one-part room temperature curing elastic adhesive that is based on silicone.It is ideal for providing a flexible in-place gasket.

N-Sil 8118L is a one-part room temperature curing elastic adhesive that is based on silicone.It is ideal for providing a flexible in-place gasket.

N-Sil 8110LV is a one-part room temperature curing elastic adhesive that is based on silicone.It is ideal for providing a flexible in-place gasket

EW 6707S is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for bonding of various substrates when low curing temperature is required. Typical application includes holder bonding for camera modules.