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Home > Products > Chemistry > Epoxy

Epoxy

Chemistry Acrylate Epoxy Silicon Based PU Others

Curing Method UV Curing Moisture Curing Thermal Curing Two Components Others

Functions Structural Bonding Sealing / Encapsulation Thermally Conductive Electrically Conductive Others

Product Name

Description

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EW 6655 is a two-component, colorless epoxy adhesive used in potting and other applications for electronic components, with excellent bond strength, high clarity, and good flow on a variety of substrates

EW 6086 is a one-component, solvent-free, heat-curing epoxy adhesive that is suitable for use as a base filler to protect chips, with fast curing, low viscosity and good flowability, and is easy to apply in a variety of ways: automated, reworkable

EW 6364 is a one-component, solvent-free, heat-curing epoxy adhesive suitable for use as a basefill to protect chips, with good adhesion to a variety of substrates, excellent high temperature and moisture resistance, high Tg and low CTE

EW 6356-8,one-part, solvent free, thermal curing adhesive,epoxy system,It is designed for grounding where conductivity is required. Typical applications include CCM/semiconductor

EW 6329 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for bonding or sealing of electronic components

EW 6303 is a one-component, solvent-free, heat-curing epoxy adhesive with excellent adhesion to a wide range of substrates, excellent resistance to mechanical shock or vibration, excellent insulation properties, and excellent resistance to environmental aging

EW 6310WS-1M150

EW 6310WS-1M150 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for sealing, bonding and protection of electronical devices and components, such as connector, chip, etc.

EW 6300UF-1

EW 6300UF-1 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for sealing, bonding, and protection of electronic devices and components, such as the insulating material for Flip-Chip manufacturing, etc.

EW 6300T-1 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for sealing, bonding, and protection of electronic devices and components, such as the insulating material for Flip-Chip manufacturing, etc.

EW 6326LT-B

EW 6326LT-B is a one-part, solvent free, low temperature curing or fast high temperature curing adhesive based on epoxy system.It is designed for sealing, bonding and protection of electronic devices and components.

EW 6650 is a two-part adhesive based on epoxy system.It is ideal for bonding or potting of electronic components，especially for switch component potting.

EW 6610N is a two-part adhesive based on epoxy system.It is ideal for potting and protection of electronic components.

EW 6318H-D10

EW 6318H-10D is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for component waterproof or reinforcement which required low shrinkage.

EW 6711-1 is a one-part, UV curing adhesive based on epoxy system.It is ideal for bonding of optical components.

EW 6300EN is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for potting of connectors and NTC.