Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a variety of substrates, no organotin, no low molecular weight cyclic polysiloxanes, excellent impact or vibration resistance

Thermally conductively modified silanes for thermally conductive bonding of electronic components, organotin free, excellent impact or vibration resistance, low contact thermal resistance, reworkable

Two-part, solvent free, thermally conductive gap filler, easily repairable and removable, low density, lightweight, low viscosity for easy dispensing, and it is suitable for non-wearing point dispensing systems, high thermal conductivity, >2.0W/(m·K).

High thermal conductivity, low thermal resistance, excellent high temperature aging resistance, good stencil printability, very low thermal weight loss, easy to repair

Excellent mechanical shock and vibration resistance, excellent ductility, excellent interfacial wetting performance, high thermal conductivity >2.0W/(m·K), in line with UL94-V0 flame retardant rating

N-SiL 8628LS is a one-component thermal grease, which is a non-flowing, highly filled compound, typical applications include thermal management of heat sinks, memory and chips, power transistors and CPUs, high thermal conductivity, low modulus and mechanical stress, easy coating and removal with alcohol or acetone, high temperature resistance, good high temperature cycle reliability, low oil permeability

N-SIL 8762 is a one-component thermally conductive gel, which is a highly filled, non-silicone compound, this product is suitable for applications that require high thermal conductivity, the material is easy to remove from the substrate, high thermal conductivity, easy to apply and remove with alcohol or isopropyl alcohol, high temperature resistance, good high temperature cycling reliability, low compressive force