N-SIL 8181 is a one-component, heat-curing, silicone-based CIPG for applications that require good sealing properties. Typical applications include electronics, device enclosure sealing, easy sizing, long open times, low stress during use, and high elongation

N-SIL 8745 is a one-component thermally conductive gel that is a highly filled, non-silicone compound. The product is suitable for applications that require moderate thermal conductivity, the material is easy to remove from the substrate, high thermal conductivity, easy to apply and remove with alcohol or isopropyl alcohol, high temperature resistance, good high temperature cycling reliability, low compressive force

N-SIL 8220L1 is a two-component silicone-based thermally conductive material. It can be cured at room temperature or heat for maximum adhesion. The product is suitable for applications with high heat dissipation requirements, typical applications are potting protection of photovoltaic, wind power, energy storage systems and on-board charger inverters [OBC], high thermal conductivity, low shrinkage and mechanical stress, high reliability and excellent impact resistance

N-SIL 8275 is a two-component, solvent-free, room-temperature curing, silicone-based sealant for PTC heater encapsulation, high temperature resistance, excellent bond strength on a wide range of substrates, low shrinkage and mechanical stress, high reliability and excellent impact resistance

N-SIL 8206 is a two-component thermally conductive material based on silicone systems. It can cure at room temperature or heat for maximum adhesion and is suitable for potting and sealing where high heat dissipation is required. Typical applications are the packaging of LED lighting power supplies and the thermal conductivity packaging of power conversion devices, with high reliability and excellent impact resistance, low shrinkage and mechanical stress, and UL94_V0

N-SIL 8210 is a two-component silicone-based thermally conductive material. It can be cured at room temperature or heat for maximum adhesion. The product is suitable for potting power adapters or connectors with heat dissipation requirements, suitable thermal conductivity, high reliability and excellent impact resistance, low shrinkage and mechanical stress

N-SIL 8381 is a two-component, heat-curing, copper-conductive microparticle and silicone based CIPG. This product is suitable for applications that require good electrical conductivity and sealing properties. Typical applications include electromagnetic shielding of electronic device enclosures.

N-Sil 8620 is a one-component thermal grease. It is a highly filled compound that is not flowing, easy to remove with alcohol or acetone, resistant to high temperatures, good reliability of high temperature cycling, low oil permeability, low modulus and mechanical stress

N-Sil 8063G is a silicone-based two-component heat-curing encapsulant with excellent electrical properties, excellent moisture and solvent resistance, excellent high temperature resistance, and high thixotropy after water immersion

N-Sil 8060G, with excellent electrical properties, excellent moisture and solvent resistance, and excellent high temperature resistance

N-SIL 8580 is a one-component, room temperature curing, silicone-based elastic adhesive, the product is suitable for sealing and protection of components on PCB, FPC reinforcement, etc., and is suitable for component fixing, fire resistance: UL94 V0, excellent electrical properties when immersed in water, excellent moisture and solvent resistance, 1.0W/m.k

N-Sil 8772 is a two-part, solvent free, thermally conductive gap filler that is based on silicone system.It is ideal for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing

N-SIL 8206 is a two-component thermally conductive material based on silicone systems. It can cure at room temperature or heat for maximum adhesion and is suitable for potting and sealing where high heat dissipation is required. Typical applications are the packaging of LED lighting power supplies and the thermal conductivity packaging of power conversion devices, with high reliability and excellent impact resistance, low shrinkage and mechanical stress, and UL94_V0

N-SIL 8180 is a one-component, solvent-free, heat-curing, silicone-based CIPG suitable for sealing and bonding of metal and surface-treated substrates with high temperature resistance; Thermally stable and can be stored at room temperature

N-Sil 8762S is a two-part, solvent free, thermally conductive gap filler that is based on silicone system.It is ideal for filling the thermal interface gap between electronic components and heat sinks or metal case to dissipate heat from critical electronic parts. Typical applications include automotive electronic control units, Autonomous driving systems,Car multimedia systems