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Home > Products > Curing Method > Moisture Curing

Moisture Curing

Chemistry Acrylate Epoxy Silicon Based PU Others

Curing Method UV Curing Moisture Curing Thermal Curing Two Components Others

Functions Structural Bonding Sealing / Encapsulation Thermally Conductive Electrically Conductive Others

Product Name

Description

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PW 2464B-3 is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

N-PU 5667F(W)

N-PU 5667F(W) is a one-part, solvent free, reactive hotmelt adhesive based on PU system.structural bonding of mobile electronic devices such as smartphones, tablets and laptops. The adhesive is pressure sensitive and gives good initial strength after bonding.

N-PU 5612TC

N-PU 5612TC is a one-part, solvent free, reactive hotmelt adhesive based on PU system.structural bonding of mobile electronic devices such as smartphones, tablets and laptops. The adhesive is pressure sensitive and gives good initial strength after bonding.

PW 2466M is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

PW 2466E-2 is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

PW 2453LM1 is a one-part, solvent free, UV and thermal dual curing adhesive based on acrylate hybrid system.It is ideal for sealing or bonding of plastic, glass and metal, as well as protecting sensitive components against mechanical and environmental stress on PCB/FPCB and CCM.