Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Conductive silica gel, used for conductive bonding, easy to apply glue in a variety of ways, high bonding strength, good reflux resistance, low volume resistivity

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, easy to apply in a variety of ways, fire resistance

Heat-curing epoxy for bonding or potting of electronic components, fast curing, excellent resistance to mechanical shock or vibration, good bending resistance, good flexibility

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing low fill, used for CSP or BGA solder joint protection underfill, can be reworked, good compatibility with flux, good flow and fast curing, excellent resistance to mechanical stress and warm stamping

EW 6513-1 is a one-part, non-conductive, thermal curing adhensive based on epoxy system . It is ideal for die attach bonding where non-conductivity is required, It could be widely used in the semiconductor industry, Good adhesion on a variety of substrates, such as: Cu, PPF and Ag surface,Excellent dispensability with minimal trailing and stringing,No die tilt issue,Excellent performance with dipping or dispensing process

N-SIL 8181 is a one-component, heat-curing, silicone-based CIPG for applications that require good sealing properties. Typical applications include electronics, device enclosure sealing, easy sizing, long open times, low stress during use, and high elongation

EW 6086 is a one-component, solvent-free, heat-curing epoxy adhesive that is suitable for use as a base filler to protect chips, with fast curing, low viscosity and good flowability, and is easy to apply in a variety of ways: automated, reworkable

N-SIL 8220L1 is a two-component silicone-based thermally conductive material. It can be cured at room temperature or heat for maximum adhesion. The product is suitable for applications with high heat dissipation requirements, typical applications are potting protection of photovoltaic, wind power, energy storage systems and on-board charger inverters [OBC], high thermal conductivity, low shrinkage and mechanical stress, high reliability and excellent impact resistance