N-SIL 8206 is a two-component thermally conductive material based on silicone systems. It can cure at room temperature or heat for maximum adhesion and is suitable for potting and sealing where high heat dissipation is required. Typical applications are the packaging of LED lighting power supplies and the thermal conductivity packaging of power conversion devices, with high reliability and excellent impact resistance, low shrinkage and mechanical stress, and UL94_V0

N-SIL 8210 is a two-component silicone-based thermally conductive material. It can be cured at room temperature or heat for maximum adhesion. The product is suitable for potting power adapters or connectors with heat dissipation requirements, suitable thermal conductivity, high reliability and excellent impact resistance, low shrinkage and mechanical stress

N-SIL 8381 is a two-component, heat-curing, copper-conductive microparticle and silicone based CIPG. This product is suitable for applications that require good electrical conductivity and sealing properties. Typical applications include electromagnetic shielding of electronic device enclosures.

EW 6364 is a one-component, solvent-free, heat-curing epoxy adhesive suitable for use as a basefill to protect chips, with good adhesion to a variety of substrates, excellent high temperature and moisture resistance, high Tg and low CTE

PW 2452-1 is a one-component, solvent-free, UV-heated, dual-curing adhesive based on an acrylate hybrid system, with excellent moisture resistance, environmental aging, temperature wash, and high and low temperature cycling properties, excellent adhesion to a variety of substrates such as plastics, glass, metals, thixotropic properties, and controllable flowability

N-Sil 8063G is a silicone-based two-component heat-curing encapsulant with excellent electrical properties, excellent moisture and solvent resistance, excellent high temperature resistance, and high thixotropy after water immersion

N-SIL 8206 is a two-component thermally conductive material based on silicone systems. It can cure at room temperature or heat for maximum adhesion and is suitable for potting and sealing where high heat dissipation is required. Typical applications are the packaging of LED lighting power supplies and the thermal conductivity packaging of power conversion devices, with high reliability and excellent impact resistance, low shrinkage and mechanical stress, and UL94_V0

N-SIL 8180 is a one-component, solvent-free, heat-curing, silicone-based CIPG suitable for sealing and bonding of metal and surface-treated substrates with high temperature resistance; Thermally stable and can be stored at room temperature

N-Sil 8206NW is a two-component silicone-based thermally conductive material that can be cured at room temperature or by heat for maximum adhesion. Suitable for potting and sealing where high heat dissipation is required. A typical application is the packaging of LED lighting power supplies.

EW 6310WS-1M150 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for sealing, bonding and protection of electronical devices and components, such as connector, chip, etc.

EW 6300UF-1 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for sealing, bonding, and protection of electronic devices and components, such as the insulating material for Flip-Chip manufacturing, etc.

EW 6300T-1 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for sealing, bonding, and protection of electronic devices and components, such as the insulating material for Flip-Chip manufacturing, etc.

EW 6326LT-B is a one-part, solvent free, low temperature curing or fast high temperature curing adhesive based on epoxy system.It is designed for sealing, bonding and protection of electronic devices and components.

EW 6318H-10D is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for component waterproof or reinforcement which required low shrinkage.

EW 6300EN is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for potting of connectors and NTC.