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    Home > Products > Curing Method > Thermal Curing

    Thermal Curing

    Chemistry Acrylate Epoxy Silicon Based PU Others
    Curing Method UV Curing Moisture Curing Thermal Curing Two Components Others
    Functions Structural Bonding Sealing / Encapsulation Thermally Conductive Electrically Conductive Others
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    EW 6709
    EW 6709 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for bonding or sealing of electronic components.
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