N-SIL 8220L1 is a two-component silicone-based thermally conductive material. It can be cured at room temperature or heat for maximum adhesion. The product is suitable for applications with high heat dissipation requirements, typical applications are potting protection of photovoltaic, wind power, energy storage systems and on-board charger inverters [OBC], high thermal conductivity, low shrinkage and mechanical stress, high reliability and excellent impact resistance

N-SIL 8275 is a two-component, solvent-free, room-temperature curing, silicone-based sealant for PTC heater encapsulation, high temperature resistance, excellent bond strength on a wide range of substrates, low shrinkage and mechanical stress, high reliability and excellent impact resistance

N-SIL 8206 is a two-component thermally conductive material based on silicone systems. It can cure at room temperature or heat for maximum adhesion and is suitable for potting and sealing where high heat dissipation is required. Typical applications are the packaging of LED lighting power supplies and the thermal conductivity packaging of power conversion devices, with high reliability and excellent impact resistance, low shrinkage and mechanical stress, and UL94_V0

N-SIL 8210 is a two-component silicone-based thermally conductive material. It can be cured at room temperature or heat for maximum adhesion. The product is suitable for potting power adapters or connectors with heat dissipation requirements, suitable thermal conductivity, high reliability and excellent impact resistance, low shrinkage and mechanical stress

N-SIL 8381 is a two-component, heat-curing, copper-conductive microparticle and silicone based CIPG. This product is suitable for applications that require good electrical conductivity and sealing properties. Typical applications include electromagnetic shielding of electronic device enclosures.

N-Sil 8063G is a silicone-based two-component heat-curing encapsulant with excellent electrical properties, excellent moisture and solvent resistance, excellent high temperature resistance, and high thixotropy after water immersion

N-Sil 8060G, with excellent electrical properties, excellent moisture and solvent resistance, and excellent high temperature resistance

N-Sil 8772 is a two-part, solvent free, thermally conductive gap filler that is based on silicone system.It is ideal for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing

N-SIL 8206 is a two-component thermally conductive material based on silicone systems. It can cure at room temperature or heat for maximum adhesion and is suitable for potting and sealing where high heat dissipation is required. Typical applications are the packaging of LED lighting power supplies and the thermal conductivity packaging of power conversion devices, with high reliability and excellent impact resistance, low shrinkage and mechanical stress, and UL94_V0

EW 6303 is a one-component, solvent-free, heat-curing epoxy adhesive with excellent adhesion to a wide range of substrates, excellent resistance to mechanical shock or vibration, excellent insulation properties, and excellent resistance to environmental aging

N-Sil 8762S is a two-part, solvent free, thermally conductive gap filler that is based on silicone system.It is ideal for filling the thermal interface gap between electronic components and heat sinks or metal case to dissipate heat from critical electronic parts. Typical applications include automotive electronic control units, Autonomous driving systems,Car multimedia systems

N-Sil 8206NW is a two-component silicone-based thermally conductive material that can be cured at room temperature or by heat for maximum adhesion. Suitable for potting and sealing where high heat dissipation is required. A typical application is the packaging of LED lighting power supplies.

EW 6650 is a two-part adhesive based on epoxy system.It is ideal for bonding or potting of electronic components，especially for switch component potting.

EW 6610N is a two-part adhesive based on epoxy system.It is ideal for potting and protection of electronic components.

N-Sil 8220 is a two-part, thermally conductive material that is based on silicone system.It is ideal for potting and sealing where high heat dissipation is required. Typical application is encapsulation for LED lighting power supply and thermally conductive potting for power conversion unit.