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Home > Products > Curing Method > Others

Others

Chemistry Acrylate Epoxy Silicon Based PU Others

Curing Method UV Curing Moisture Curing Thermal Curing Two Components Others

Functions Structural Bonding Sealing / Encapsulation Thermally Conductive Electrically Conductive Others

Product Name

Description

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Conductive silica gel, used for electromagnetic shielding CIPG, curable at room temperature, excellent electromagnetic shielding performance, excellent sealing

N-Sil 8511HB

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8512BT

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, do not contain organotin, have excellent impact or vibration resistance, and change color from blue to white when heated

N-Sil 8522BL(HQ)

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8522HB

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8522LD

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature

N-Sil 8522WL(HQ)

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature

N-Sil 8522WL(PO)

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8523W

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8523WL-2(HQ)

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8530L

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8537P

Modified silanes for sealing or bonding electronic components, easy to rework, no organotin, high initial bond strength, excellent shock or vibration resistance

N-Sil 8539B

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength