Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a variety of substrates, no organotin, no low molecular weight cyclic polysiloxanes, excellent impact or vibration resistance

Thermally conductively modified silanes for thermally conductive bonding of electronic components, organotin free, excellent impact or vibration resistance, low contact thermal resistance, reworkable

HM PUR, Used for bonding and sealing a variety of substrates, it has excellent bonding strength on a variety of substrates, good chemical and environmental aging resistance, initial cooling and curing, and then curing by moisture

HM PUR, Used for bonding and sealing a variety of substrates, good chemical and environmental aging resistance, good chemical and environmental aging resistance, initial cooling and curing, followed by moisture curing

High thermal conductivity, low thermal resistance, excellent high temperature aging resistance, good stencil printability, very low thermal weight loss, easy to repair

It has excellent adhesion performance, excellent vibration and impact resistance, supports dual curing methods at room temperature and heating, and has a thermal conductivity of 1.2W/(m·K), which meets the UL94-V0 flame retardant rating

N-SiL 8628LS is a one-component thermal grease, which is a non-flowing, highly filled compound, typical applications include thermal management of heat sinks, memory and chips, power transistors and CPUs, high thermal conductivity, low modulus and mechanical stress, easy coating and removal with alcohol or acetone, high temperature resistance, good high temperature cycle reliability, low oil permeability

N-SIL 8762 is a one-component thermally conductive gel, which is a highly filled, non-silicone compound, this product is suitable for applications that require high thermal conductivity, the material is easy to remove from the substrate, high thermal conductivity, easy to apply and remove with alcohol or isopropyl alcohol, high temperature resistance, good high temperature cycling reliability, low compressive force

N-SIL 8745 is a one-component thermally conductive gel that is a highly filled, non-silicone compound. The product is suitable for applications that require moderate thermal conductivity, the material is easy to remove from the substrate, high thermal conductivity, easy to apply and remove with alcohol or isopropyl alcohol, high temperature resistance, good high temperature cycling reliability, low compressive force

N-SIL 8220L1 is a two-component silicone-based thermally conductive material. It can be cured at room temperature or heat for maximum adhesion. The product is suitable for applications with high heat dissipation requirements, typical applications are potting protection of photovoltaic, wind power, energy storage systems and on-board charger inverters [OBC], high thermal conductivity, low shrinkage and mechanical stress, high reliability and excellent impact resistance

N-SIL 8206 is a two-component thermally conductive material based on silicone systems. It can cure at room temperature or heat for maximum adhesion and is suitable for potting and sealing where high heat dissipation is required. Typical applications are the packaging of LED lighting power supplies and the thermal conductivity packaging of power conversion devices, with high reliability and excellent impact resistance, low shrinkage and mechanical stress, and UL94_V0

N-Sil 8620 is a one-component thermal grease. It is a highly filled compound that is not flowing, easy to remove with alcohol or acetone, resistant to high temperatures, good reliability of high temperature cycling, low oil permeability, low modulus and mechanical stress

EW 6356-8,one-part, solvent free, thermal curing adhesive,epoxy system,It is designed for grounding where conductivity is required. Typical applications include CCM/semiconductor

N-PU 5663ST is a one-component, solvent-free, reactive hot melt polyurethane adhesive suitable for bonding and sealing a wide range of materials, pressure-sensitive, providing good initial strength, initial cooling and subsequent moisture curing, good chemical and environmental aging resistance, low viscosity and long open time.