Two-component acrylic for structural bonding of a variety of materials such as plastics, metals, ceramics, and wood, low odor, excellent high temperature resistance, fast curing at room temperature, no special surface treatment

Two-component acrylic for structural bonding of a variety of materials such as plastics, metals, ceramics, and wood, low odor, excellent high temperature resistance, fast curing at room temperature, no special surface treatment

Two-component acrylic for structural bonding of a variety of materials, such as plastics, metals and other typical applications for automotive component bonding, thermoplastic molding shells and computer assembly, low odor, excellent bond strength, high impact resistance, no flow

Two-component acrylic, used for structural bonding of a variety of materials, such as plastics, metals and other typical applications for automotive component bonding, thermoplastic molding shells and computer assembly, low odor, excellent bonding strength, excellent toughness and impact resistance, no flow

Two-component acrylic, used for structural bonding of a variety of materials, such as plastics, metals and other typical applications for automotive component bonding, thermoplastic molding shells and computer assembly, excellent bonding strength, excellent toughness and impact resistance, no flow

Two-component acrylic, used for structural bonding of a variety of materials, such as plastics, metals and other typical applications for automotive component bonding, thermoplastic molding shells and computer assembly, excellent bonding strength, excellent toughness and impact resistance, no flow

Room temperature vulcanized silicone sealant for sealing or bonding electronic components, organotin free, excellent adhesion to a wide range of substrates, excellent impact or vibration resistance, high initial bond strength

Room temperature vulcanized silicone sealant for sealing or bonding electronic components, organotin free, excellent adhesion to a variety of substrates, excellent impact or vibration resistance, high initial adhesion

Conductive silica gel, used for conductive bonding, easy to apply glue in a variety of ways, high bonding strength, good reflux resistance, low volume resistivity

Heat-curing epoxy for bonding or potting of electronic components, fast curing, excellent resistance to mechanical shock or vibration, good bending resistance, good flexibility

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance