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Home > Products > Functions > Structural Bonding

Structural Bonding

Chemistry Acrylate Epoxy Silicon Based PU Others

Curing Method UV Curing Moisture Curing Thermal Curing Two Components Others

Functions Structural Bonding Sealing / Encapsulation Thermally Conductive Electrically Conductive Others

Product Name

Description

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Two-component epoxy for bonding or reinforcing electronic components, excellent adhesion to a variety of substrates, high thixotropy, long operating time, easy to apply in a variety of ways

Two-component epoxy, used for bonding or reinforcing electronic components, has excellent adhesion to a variety of substrates, optical transparency, low viscosity, good flowability, good waterproofing and aging resistance

Two-component epoxy for bonding or reinforcing electronic components, excellent adhesion to a variety of substrates, high thixotropy, long operating time, easy to apply in a variety of ways

N-Sil 8511HB

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8512BT

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, do not contain organotin, have excellent impact or vibration resistance, and change color from blue to white when heated

N-Sil 8522BL(HQ)

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8522HB

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8522LD

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature

N-Sil 8522WL(HQ)

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature

N-Sil 8522WL(PO)

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8523W

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8523WL-2(HQ)

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8530L

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength