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    Structural Bonding

    Chemistry Acrylate Epoxy Silicon Based PU Others
    Curing Method UV Curing Moisture Curing Thermal Curing Two Components Others
    Functions Structural Bonding Sealing / Encapsulation Thermally Conductive Electrically Conductive Others
    Product Name
    Description
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    N-Sil 8537P
    Modified silanes for sealing or bonding electronic components, easy to rework, no organotin, high initial bond strength, excellent shock or vibration resistance
    N-Sil 8539B
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539BH
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539E
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539G
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539HB
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539M
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539N
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539S
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539W
    Modified silanes for sealing or bonding electronic components, organotin free, excellent adhesion to a wide range of substrates, good flowability, ease of use, excellent impact or vibration resistance
    N-Sil 8551
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8551NT
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8551W
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8552
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8552HB
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
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