N-PU 5663 is a one-component, reactive hot melt polyurethane adhesive suitable for bonding and sealing a variety of materials, pressure-sensitive, providing good initial strength immediately after bonding, excellent bonding strength on a variety of substrates, good chemical and environmental aging resistance, low viscosity and fast curing

N-SIL 8580 is a one-component, room temperature curing, silicone-based elastic adhesive, the product is suitable for sealing and protection of components on PCB, FPC reinforcement, etc., and is suitable for component fixing, fire resistance: UL94 V0, excellent electrical properties when immersed in water, excellent moisture and solvent resistance, 1.0W/m.k

N-SIL 8206 is a two-component thermally conductive material based on silicone systems. It can cure at room temperature or heat for maximum adhesion and is suitable for potting and sealing where high heat dissipation is required. Typical applications are the packaging of LED lighting power supplies and the thermal conductivity packaging of power conversion devices, with high reliability and excellent impact resistance, low shrinkage and mechanical stress, and UL94_V0

EW 6303 is a one-component, solvent-free, heat-curing epoxy adhesive with excellent adhesion to a wide range of substrates, excellent resistance to mechanical shock or vibration, excellent insulation properties, and excellent resistance to environmental aging

N-SIL 8180 is a one-component, solvent-free, heat-curing, silicone-based CIPG suitable for sealing and bonding of metal and surface-treated substrates with high temperature resistance; Thermally stable and can be stored at room temperature

PW 1403LV is a one-component, solvent-free, UV-curable adhesive based on acrylate systems. This product is suitable for sealing and bonding plastic materials that require resistance to high humidity environments.

EW 6310WS-1M150 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for sealing, bonding and protection of electronical devices and components, such as connector, chip, etc.

EW 6300UF-1 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for sealing, bonding, and protection of electronic devices and components, such as the insulating material for Flip-Chip manufacturing, etc.

EW 6300T-1 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for sealing, bonding, and protection of electronic devices and components, such as the insulating material for Flip-Chip manufacturing, etc.

EW 6326LT-B is a one-part, solvent free, low temperature curing or fast high temperature curing adhesive based on epoxy system.It is designed for sealing, bonding and protection of electronic devices and components.

EW 6650 is a two-part adhesive based on epoxy system.It is ideal for bonding or potting of electronic components，especially for switch component potting.

PW 2460N-1L is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

EW 6711-1 is a one-part, UV curing adhesive based on epoxy system.It is ideal for bonding of optical components.

N-Sil 8133 is a one-part room temperature curing elastic adhesive that is based on silicone.It is ideal for sealing or bonding of electric/electronic components.

N-Sil 8133-1 is a one-part room temperature curing elastic adhesive that is based on silicone.It is ideal sealing and bonding of electric or electronic components