Structural Bonding - CollTech Group dedicated to deliver exceptional, customized solutions and services to our valued customers.

Home
About Us
Company
Media & Resources
Environmental
Applications

Major Markets

Consumer Electronics

Automotive

Semiconductor

Other Industries
Products
Product Types
Customer Support
- · Equipment Partners
Investor
Contact Us
Contact
- Contact
- Messeage
- Career

Tel：+1-408-341-6373

Home > Products > Functions > Structural Bonding

Structural Bonding

Chemistry Acrylate Epoxy Silicon Based PU Others

Curing Method UV Curing Moisture Curing Thermal Curing Two Components Others

Functions Structural Bonding Sealing / Encapsulation Thermally Conductive Electrically Conductive Others

Product Name

Description

View

PW 1518N is a one-part, solvent free, UV curing adhesive based on acrylate system.It is ideal for sealing and bonding of plastic materials where high moisture resistance is required.

PW 1508LB-1

PW 1508LB-1 is a one-part, solvent free, UV fast curing adhesive based on acrylate system.It is ideal for sealing and bonding of plastic materials where high moisture resistance is required.

N-PU 5667F(W)

N-PU 5667F(W) is a one-part, solvent free, reactive hotmelt adhesive based on PU system.structural bonding of mobile electronic devices such as smartphones, tablets and laptops. The adhesive is pressure sensitive and gives good initial strength after bonding.

N-PU 5612TC

N-PU 5612TC is a one-part, solvent free, reactive hotmelt adhesive based on PU system.structural bonding of mobile electronic devices such as smartphones, tablets and laptops. The adhesive is pressure sensitive and gives good initial strength after bonding.

EW 6640M2 is a two-part adhesive based on epoxy system.It is ideal for bonding or reinforcing of electronic components.

EW 6709 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for bonding or sealing of electronic components.

PW 2466M is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

PW 2466E-2 is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

PW 2453LM1 is a one-part, solvent free, UV and thermal dual curing adhesive based on acrylate hybrid system.It is ideal for sealing or bonding of plastic, glass and metal, as well as protecting sensitive components against mechanical and environmental stress on PCB/FPCB and CCM.

PW 1401-14 is a one-part, solvent free, UV fast curing adhesive based on acrylate system.It is ideal for sealing and bonding of plastic materials where high moisture resistance is required.