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Home > Products > Functions > Sealing / Encapsulation

Sealing / Encapsulation

Chemistry Acrylate Epoxy Silicon Based PU Others

Curing Method UV Curing Moisture Curing Thermal Curing Two Components Others

Functions Structural Bonding Sealing / Encapsulation Thermally Conductive Electrically Conductive Others

Product Name

Description

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EW 6709 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for bonding or sealing of electronic components.

PW 2466M is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

PW 2466E-2 is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

PW 2453LM1 is a one-part, solvent free, UV and thermal dual curing adhesive based on acrylate hybrid system.It is ideal for sealing or bonding of plastic, glass and metal, as well as protecting sensitive components against mechanical and environmental stress on PCB/FPCB and CCM.

PW 1401-14 is a one-part, solvent free, UV fast curing adhesive based on acrylate system.It is ideal for sealing and bonding of plastic materials where high moisture resistance is required.

PW 1428M is a one-part, solvent free, UV curing adhesive based on acrylate system.It is ideal for cured-in-place gasket for edge sealing and bonding applications.