Sealing / Encapsulation

Product Name
Description
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PW 1516HF
UV curable acrylic, used for sealing, potting and bonding of plastics, glass, metal and FR4, as well as protecting sensitive components on PCB/FPCB, low UV curing energy and low curing temperature, excellent moisture and high temperature resistance, excellent mechanical impact resistance, easy to apply in a variety of ways
PW 1516NF
UV curable acrylic for sealing, potting and bonding of plastics, glass, metal and FR4, as well as to protect solder joints or sensitive components on PCB/FPCB, low UV curing energy and low curing temperature, excellent moisture and high temperature resistance, excellent mechanical impact resistance, easy to apply in a variety of ways
PW 1516NF-2
UV curable acrylic for sealing, potting and bonding of plastics, glass, metal and FR4, as well as to protect solder joints or sensitive components on PCB/FPCB, low UV curing energy and low curing temperature, excellent moisture and high temperature resistance, excellent mechanical impact resistance, easy to apply in a variety of ways
PW 1518M
UV curing acrylic for PC sealing and bonding on a variety of materials, fast UV radiation curing, very low water absorption, excellent moisture resistance, environmental aging, temperature punch and high and low temperature cycle performance
PW 1518MB
UV-curable acrylic for PC sealing and bonding on a variety of materials, excellent bonding strength, excellent moisture resistance, easy to apply in a variety of ways
PW 1462
UV moisture-cured acrylic is used for sealing, potting and bonding on a variety of materials, rapid UV radiation curing, and then moisture curing to cover the shadow area, suitable flexibility and softness
PW 2440HR(HQ)
UV moisture curing acrylic for sealing, potting and bonding of plastics, glass, metal and FR4, as well as protecting sensitive components on PCBs/FPCBs, rapid UV curing followed by moisture curing to cover shadow parts, IBOA free
PW 2440LR
UV moisture curing acrylic for PC sealing and bonding on a variety of materials such as PMMA, glass, aluminum and stainless steel, rapid UV curing, followed by moisture curing to cover shadow parts, good flexibility and softness, IBOA free
PW 2440NR(HQ)
UV moisture-cured acrylic for bonding on a wide range of materials. Typical applications are camera modules, lens and IR filter bonding, rapid UV curing, followed by moisture curing to cover shadows, good flexibility and softness, IBOA-free
PW 2440NR(PO)
UV moisture-cured acrylic for bonding on a wide range of materials. Typical applications are camera modules, lens and IR filter bonding, rapid UV curing, followed by moisture curing to cover shadows, good flexibility and softness, IBOA-free
PW 2460N
UV moisture-cured acrylic for bonding on a wide range of materials. Typical applications are camera modules, lens and IR filter bonding, rapid UV curing, followed by moisture curing to cover the shadows, suitable flexibility and softness, IBOA-free
PW 2466R
UV moisture curing acrylic for sealing, potting and bonding of plastics, glass, metal and FR4, as well as to protect sensitive components on PCBs/FPCBs, rapid UV curing, followed by moisture curing to cover shadow parts, good flexibility and softness, IBOA free
CT 2290
UV photothermal curing acrylic for sealing and bonding plastics, glass, metals and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stress, excellent moisture resistance, environmental aging, temperature punch and high and low temperature cycling performance, low shrinkage and stress during curing, high SIR and low Dk/Df
CT 2295
Ultraviolet photothermal curing acrylic is used for sealing and bonding aluminum on a variety of materials, excellent moisture resistance, environmental aging, temperature punching and high and low temperature cycle performance, high SIR and low Dk/Df, thixotropic performance and controllable fluidity
PW 1488
UV photothermal curing acrylic is used for PC sealing and bonding on a variety of materials, excellent adhesion to a variety of substrates, excellent moisture resistance, environmental aging, temperature punch and high and low temperature cycle performance, low shrinkage and stress during curing