HM PUR, Used for bonding and sealing a variety of substrates, good chemical and environmental aging resistance, good chemical and environmental aging resistance, initial cooling and curing, followed by moisture curing

EW 6655 is a two-component, colorless epoxy adhesive used in potting and other applications for electronic components, with excellent bond strength, high clarity, and good flow on a variety of substrates

N-SIL 8181 is a one-component, heat-curing, silicone-based CIPG for applications that require good sealing properties. Typical applications include electronics, device enclosure sealing, easy sizing, long open times, low stress during use, and high elongation

EW 6086 is a one-component, solvent-free, heat-curing epoxy adhesive that is suitable for use as a base filler to protect chips, with fast curing, low viscosity and good flowability, and is easy to apply in a variety of ways: automated, reworkable

N-SIL 8220L1 is a two-component silicone-based thermally conductive material. It can be cured at room temperature or heat for maximum adhesion. The product is suitable for applications with high heat dissipation requirements, typical applications are potting protection of photovoltaic, wind power, energy storage systems and on-board charger inverters [OBC], high thermal conductivity, low shrinkage and mechanical stress, high reliability and excellent impact resistance

N-SIL 8206 is a two-component thermally conductive material based on silicone systems. It can cure at room temperature or heat for maximum adhesion and is suitable for potting and sealing where high heat dissipation is required. Typical applications are the packaging of LED lighting power supplies and the thermal conductivity packaging of power conversion devices, with high reliability and excellent impact resistance, low shrinkage and mechanical stress, and UL94_V0

N-SIL 8210 is a two-component silicone-based thermally conductive material. It can be cured at room temperature or heat for maximum adhesion. The product is suitable for potting power adapters or connectors with heat dissipation requirements, suitable thermal conductivity, high reliability and excellent impact resistance, low shrinkage and mechanical stress

PW 1465 is a one-part, UV and moisture dua curing adhesive based on acrylate hybrid system. It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

EW 6364 is a one-component, solvent-free, heat-curing epoxy adhesive suitable for use as a basefill to protect chips, with good adhesion to a variety of substrates, excellent high temperature and moisture resistance, high Tg and low CTE

PW 2452-1 is a one-component, solvent-free, UV-heated, dual-curing adhesive based on an acrylate hybrid system, with excellent moisture resistance, environmental aging, temperature wash, and high and low temperature cycling properties, excellent adhesion to a variety of substrates such as plastics, glass, metals, thixotropic properties, and controllable flowability

N-Sil 8063G is a silicone-based two-component heat-curing encapsulant with excellent electrical properties, excellent moisture and solvent resistance, excellent high temperature resistance, and high thixotropy after water immersion

N-Sil 8060G, with excellent electrical properties, excellent moisture and solvent resistance, and excellent high temperature resistance

PW 2440MR is a one-component, solvent-free, UV-moisture dual-cure adhesive based on an acrylate hybrid system. It is suitable for sealing, potting and bonding plastics, glass, metal and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

N-PU 5663ST is a one-component, solvent-free, reactive hot melt polyurethane adhesive suitable for bonding and sealing a wide range of materials, pressure-sensitive, providing good initial strength, initial cooling and subsequent moisture curing, good chemical and environmental aging resistance, low viscosity and long open time.

EW 6329 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for bonding or sealing of electronic components