N-PU 5663 is a one-component, reactive hot melt polyurethane adhesive suitable for bonding and sealing a variety of materials, pressure-sensitive, providing good initial strength immediately after bonding, excellent bonding strength on a variety of substrates, good chemical and environmental aging resistance, low viscosity and fast curing

N-SIL 8580 is a one-component, room temperature curing, silicone-based elastic adhesive, the product is suitable for sealing and protection of components on PCB, FPC reinforcement, etc., and is suitable for component fixing, fire resistance: UL94 V0, excellent electrical properties when immersed in water, excellent moisture and solvent resistance, 1.0W/m.k

PW 1446C4, one-component, solvent-free, based on acrylic system, UV curing, cushioning, sealing, good flexibility, good water resistance

N-Sil 8772 is a two-part, solvent free, thermally conductive gap filler that is based on silicone system.It is ideal for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing

N-SIL 8206 is a two-component thermally conductive material based on silicone systems. It can cure at room temperature or heat for maximum adhesion and is suitable for potting and sealing where high heat dissipation is required. Typical applications are the packaging of LED lighting power supplies and the thermal conductivity packaging of power conversion devices, with high reliability and excellent impact resistance, low shrinkage and mechanical stress, and UL94_V0

EW 6303 is a one-component, solvent-free, heat-curing epoxy adhesive with excellent adhesion to a wide range of substrates, excellent resistance to mechanical shock or vibration, excellent insulation properties, and excellent resistance to environmental aging

N-SIL 8180 is a one-component, solvent-free, heat-curing, silicone-based CIPG suitable for sealing and bonding of metal and surface-treated substrates with high temperature resistance; Thermally stable and can be stored at room temperature

N-Sil 8762S is a two-part, solvent free, thermally conductive gap filler that is based on silicone system.It is ideal for filling the thermal interface gap between electronic components and heat sinks or metal case to dissipate heat from critical electronic parts. Typical applications include automotive electronic control units, Autonomous driving systems,Car multimedia systems

N-Sil 8206NW is a two-component silicone-based thermally conductive material that can be cured at room temperature or by heat for maximum adhesion. Suitable for potting and sealing where high heat dissipation is required. A typical application is the packaging of LED lighting power supplies.

EW 6310WS-1M150 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for sealing, bonding and protection of electronical devices and components, such as connector, chip, etc.

EW 6300UF-1 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for sealing, bonding, and protection of electronic devices and components, such as the insulating material for Flip-Chip manufacturing, etc.

EW 6300T-1 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for sealing, bonding, and protection of electronic devices and components, such as the insulating material for Flip-Chip manufacturing, etc.

EW 6326LT-B is a one-part, solvent free, low temperature curing or fast high temperature curing adhesive based on epoxy system.It is designed for sealing, bonding and protection of electronic devices and components.

EW 6650 is a two-part adhesive based on epoxy system.It is ideal for bonding or potting of electronic components，especially for switch component potting.

EW 6610N is a two-part adhesive based on epoxy system.It is ideal for potting and protection of electronic components.