Thermally Conductive

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Description
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N-Sil 8206
N-SIL 8206 is a two-component thermally conductive material based on silicone systems. It can cure at room temperature or heat for maximum adhesion and is suitable for potting and sealing where high heat dissipation is required. Typical applications are the packaging of LED lighting power supplies and the thermal conductivity packaging of power conversion devices, with high reliability and excellent impact resistance, low shrinkage and mechanical stress, and UL94_V0
N-Sil 8210
N-SIL 8210 is a two-component silicone-based thermally conductive material. It can be cured at room temperature or heat for maximum adhesion. The product is suitable for potting power adapters or connectors with heat dissipation requirements, suitable thermal conductivity, high reliability and excellent impact resistance, low shrinkage and mechanical stress
N-Sil 8620
N-Sil 8620 is a one-component thermal grease. It is a highly filled compound that is not flowing, easy to remove with alcohol or acetone, resistant to high temperatures, good reliability of high temperature cycling, low oil permeability, low modulus and mechanical stress
N-Sil 8206N
N-SIL 8206 is a two-component thermally conductive material based on silicone systems. It can cure at room temperature or heat for maximum adhesion and is suitable for potting and sealing where high heat dissipation is required. Typical applications are the packaging of LED lighting power supplies and the thermal conductivity packaging of power conversion devices, with high reliability and excellent impact resistance, low shrinkage and mechanical stress, and UL94_V0
N-Sil 8762S
N-Sil 8762S is a two-part, solvent free, thermally conductive gap filler that is based on silicone system.It is ideal for filling the thermal interface gap between electronic components and heat sinks or metal case to dissipate heat from critical electronic parts. Typical applications include automotive electronic control units, Autonomous driving systems,Car multimedia systems
N-Sil 8206NW
N-Sil 8206NW is a two-component silicone-based thermally conductive material that can be cured at room temperature or by heat for maximum adhesion. Suitable for potting and sealing where high heat dissipation is required. A typical application is the packaging of LED lighting power supplies.
N-Sil 8735-40
N-SiL 8745 is a one-component thermally conductive gel, which is a highly packed compound. This product is suitable for applications that require moderate thermal conductivity and the material is easy to remove from the substrate.
N-Sil 8745NSL
N-Sil 8745NSL is a one-component thermally conductive gel, which is a highly filled, non-silicone compound suitable for applications requiring high thermal conductivity, low compressive force, minimum thermal resistance for maximum thermal conductivity, high thermal conductivity, easy coating and removal with alcohol or isopropanol, high temperature resistance, good high temperature cycling reliability, low modulus and mechanical stress; After the element is laminated, it is not easy to overflow during heating use
N-Sil 8650-2
N-SIL 8650-2 is a one-component thermal grease. It is a highly filled compound that is not flowing. This product is suitable for applications that require moderate thermal conductivity. The material is easy to remove from the substrate. Typical applications include thermal management of heat sinks, memory and chips, power transistors, and CPUs.
N-SiL 8628NX
N-SiL 8628NX is a one-part thermally conductive silicone grease. It is non-flowing with highly filled compounds..It is ideal for applications that require high thermal conductivity. It is easy to be removed from the substrates. Typical applications include thermal management of heat sinks, memory and chip sets,power transistors and CPU etc..
N-Sil 8220
N-Sil 8220 is a two-part, thermally conductive material that is based on silicone system.It is ideal for potting and sealing where high heat dissipation is required. Typical application is encapsulation for LED lighting power supply and thermally conductive potting for power conversion unit.